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首页 > Connectors, InterconnectsSockets for ICs, Transistors > DIP316-001BLF现货代理商

DIP316-001BLF

DIP316-001BLF
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产品型号 DIP316-001BLF
制造商 Amphenol ICC (FCI)
产品介绍 CONN IC DIP SOCKET 16POS GOLD
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Product parameter

制造商Amphenol ICC (FCI) 制造商产品编号DIP316-001BLF
产品介绍CONN IC DIP SOCKET 16POS GOLD 详细描述16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
数据表 Datasheet 类别Connectors, InterconnectsSockets for ICs, Transistors
生产制造商Amphenol ICC (FCI) 系列-
包装Bag Product StatusObsolete
类型DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid)16 (2 x 8)
Pitch - Mating0.100" (2.54mm) Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm) Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole FeaturesOpen Frame
TerminationSolder Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature- Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0 Contact Resistance-
基本产品编号DIP316 文档和媒体资源DIP306-648 B Series
PCN Obsolescence/ EOLMultiple Devices/Sockets 04/Dec/2008 HTML数据表DIP306-648 B Series
湿度敏感度(MSL)1 (Unlimited) REACH状态REACH Unaffected
ECCNEAR99 安全8536.69.4040
Standard Package2,700 110-41-316-41-001000Mill-Max Manufacturing Corp.
2,049ED90517-ND $1.58000Similar
110-13-316-41-801000Mill-Max Manufacturing Corp. 59ED2110-ND
$6.07000Similar 115-43-316-41-001000Mill-Max Manufacturing Corp.
350ED90199-ND $2.23000Similar
110-44-316-41-001000Mill-Max Manufacturing Corp. 1,392ED90050-ND
$1.03000Similar 110-99-316-41-001000Mill-Max Manufacturing Corp.
1,666ED3116-ND

DIP316-001BLF相关的资讯

DIP316-001BLF 相关的关键词

DIP316-001BLF是一款高性能、可靠性强的Connectors, InterconnectsSockets for ICs, Transistors,如果您在找DIP316-001BLF,由知名制造商Amphenol ICC (FCI)设计生产,产品说明:CONN IC DIP SOCKET 16POS GOLD 16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole,这款Connectors, InterconnectsSockets for ICs, Transistors汇聚了多项优势。
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