参数名称 | 参数值 |
---|---|
Product Status | Active |
Proto Board Type | DIP to DIP |
Package Accepted | - |
Number of Positions | 8 |
Pitch | 0.100" (2.54mm) |
Board Thickness | 0.063" (1.60mm) |
Material | FR4 Epoxy Glass |
Size/ Dimension | 0.700" L x 0.400" W (17.78mm x 10.16mm) |
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Chip Quik, Inc. 适配器、分线板 产品 DIP600T300P08
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