参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | Solder Sphere |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.016" (0.40mm) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | - |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Jar |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
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Chip Quik, Inc. 焊接 产品 SMD2032
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