| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn63Pb37 (63/37) |
| Diameter | - |
| Melting Point | 361°F (183°C) |
| Flux Type | Water Soluble |
| Wire Gauge | - |
| Mesh Type | 4 |
| Process | Leaded |
| Form | Jar, 17.64 oz (500g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |
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Chip Quik, Inc. 焊接 产品 WS991AX500T4
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