| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter | - |
| Melting Point | 281°F (138°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | 3 |
| Process | Lead Free |
| Form | Jar, 8.8 oz (250g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
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Chip Quik, Inc. 焊接 产品 SMDLTLFP250T3
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