参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | Solder Paste |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Melting Point | 281°F (138°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 5 |
Process | Lead Free |
Form | Syringe, 1.23 oz (35g), 10cc |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
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Chip Quik, Inc. 焊接 产品 SMDLTLFP10T5
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