| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 422 ~ 428°F (217 ~ 220°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | 6 |
| Process | Lead Free |
| Form | Jar, 1.76 oz (50g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
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Chip Quik, Inc. 焊接 产品 SMD291SNL50T6
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