参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | Solder Paste |
Composition | Sn63Pb37 (63/37) |
Diameter | - |
Melting Point | 361°F (183°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Leaded |
Form | Jar, 8.8 oz (250g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
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Chip Quik, Inc. 焊接 产品 SMD291AX250T4
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