| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Connector Type | High Density Array, Female |
| Number of Positions | 400 |
| Pitch | 0.050" (1.27mm) |
| Number of Rows | 8 |
| Mounting Type | Through Hole, Right Angle, Press-Fit |
| Features | Board Guide, Solder Retention |
| Contact Finish | Gold |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Mated Stacking Heights | - |
| Height Above Board | - |
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Samtec, Inc. 阵列、边缘型、夹层（板对板） 产品 SEAFP-50-01-S-08-RA-WT-GP
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