参数名称 | 参数值 |
---|---|
Product Status | Obsolete |
Type | SIP |
Number of Positions or Pins (Grid) | 16 (1 x 16) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Tin |
Contact Finish Thickness - Mating | 150.0µin (3.81µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 200.0µin (5.08µm) |
Contact Material - Post | Brass |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature | - |
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Amphenol Communications Solutions IC插座 产品 SIP1X16-014BLF
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