| 参数名称 | 参数值 |
|---|---|
| Product Status | Obsolete |
| Type | SIP |
| Number of Positions or Pins (Grid) | 8 (1 x 8) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin-Lead |
| Contact Finish Thickness - Mating | 150.0µin (3.81µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 150.0µin (3.81µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Fluoropolymer (FP) |
| Operating Temperature | -55°C ~ 105°C |
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