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BU640Z-178-HT

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IC插座

CONN IC DIP SOCKET 64POS GOLD

参数名称参数值
Product StatusObsolete
TypeDIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid)64 (2 x 32)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating78.7µin (2.00µm)
Contact Material - MatingBeryllium Copper
Mounting TypeSurface Mount
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostCopper
Contact Finish Thickness - PostFlash
Contact Material - PostBrass
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Operating Temperature-55°C ~ 125°C

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On-Shore Technology, Inc. IC插座 产品 BU640Z-178-HT

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