| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Type | BGA |
| Number of Positions or Pins (Grid) | 352 (26 x 26) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 29.5µin (0.75µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Brass |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
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Preci-Dip IC插座 产品 514-83-352M26-001148
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