| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Type | PGA |
| Number of Positions or Pins (Grid) | - |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 200.0µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | - |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 105°C |
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Aries Electronics, Inc. IC插座 产品 163-PGM15066-10T
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