| 参数名称 | 参数值 |
|---|---|
| Product Status | Active |
| Type | BGA |
| Number of Positions or Pins (Grid) | 272 (20 x 20) |
| Pitch - Mating | 0.050" (1.27mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.050" (1.27mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Material - Post | Brass |
| Housing Material | FR4 Epoxy Glass |
| Operating Temperature | -55°C ~ 125°C |
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Preci-Dip IC插座 产品 550-10-272M20-001166
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