参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | DIP, ZIF (ZIP) |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature | - |
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Aries Electronics, Inc. IC插座 产品 24-516-11S
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