参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | - |
Number of Positions or Pins (Grid) | 18 (2 x 9) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
Contact Material - Mating | Phosphor Bronze |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 20.0µin (0.51µm) |
Contact Material - Post | Phosphor Bronze |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature | - |
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Samtec, Inc. IC插座 产品 APA-318-G-N
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