参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 20 (2 x 10) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 200.0µin (5.08µm) |
Contact Material - Post | Brass |
Housing Material | Polybutylene Terephthalate (PBT) |
Operating Temperature | -55°C ~ 105°C |
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CnC Tech IC插座 产品 211-1-20-003
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