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HSE-B18508-035H-03

¥9.45
散热片
CUI Devices

HEAT SINK, EXTRUSION, TO-218, 50

参数名称参数值
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-218
Attachment MethodClip and PC Pin
ShapeRectangular, Angled Fins
Length2.000" (50.80mm)
Width1.638" (41.60mm)
Diameter-
Fin Height0.984" (25.00mm)
Power Dissipation @ Temperature Rise13.0W @ 75°C
Thermal Resistance @ Forced Air Flow3.44°C/W @ 200 LFM
Thermal Resistance @ Natural5.77°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

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