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HSE-B20500-040H-01

¥6.62
散热片
CUI Devices

HEAT SINK, EXTRUSION, TO-220, 50

参数名称参数值
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-220
Attachment MethodPC Pin
ShapeRectangular, Angled Fins
Length1.969" (50.00mm)
Width1.359" (34.50mm)
Diameter-
Fin Height0.492" (12.50mm)
Power Dissipation @ Temperature Rise8.9W @ 75°C
Thermal Resistance @ Forced Air Flow8.90°C/W @ 200 LFM
Thermal Resistance @ Natural8.43°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

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