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IW-HSKALU-CLASLR-CU03

¥396.00
散热片
iWave Systems

ZU+ MPSOC SOM MODULE HEATSINK

参数名称参数值
Product StatusActive
TypeTop Mount
Package CooledFPGA
Attachment MethodBolt On
ShapeRectangular, Fins
Length3.740" (95.00mm)
Width2.953" (75.00mm)
Diameter-
Fin Height1.181" (30.00mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
MaterialAluminum
Material Finish-

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