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HSE-B254-045H

¥8.14
散热片
CUI Devices

HEAT SINK, EXTRUSION, TO-220, 25

参数名称参数值
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-220
Attachment MethodBolt On and PC Pin
ShapeRectangular, Angled Fins
Length1.000" (25.40mm)
Width1.772" (45.00mm)
Diameter-
Fin Height0.500" (12.70mm)
Power Dissipation @ Temperature Rise6.4W @ 75°C
Thermal Resistance @ Forced Air Flow3.86°C/W @ 200 LFM
Thermal Resistance @ Natural11.72°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized

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