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HSS05-C20-SMT-TR

¥7.06
散热片
CUI Devices

HEAT SINK, STAMPING, TO-220, 12.

参数名称参数值
Product StatusActive
TypeBoard Level, Vertical
Package CooledTO-220
Attachment Method-
ShapeRectangular
Length1.031" (26.20mm)
Width0.500" (12.70mm)
Diameter-
Fin Height0.390" (9.91mm)
Power Dissipation @ Temperature Rise2.3W @ 75°C
Thermal Resistance @ Forced Air Flow14.00°C/W @ 200 LFM
Thermal Resistance @ Natural32.69°C/W
MaterialCopper Alloy
Material FinishTin

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