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374024B00035G

¥13.10
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BOYD

HEATSINK BGA 23X23X10MM W/ADH

参数名称参数值
Product StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length0.906" (23.01mm)
Width0.906" (23.01mm)
Diameter-
Fin Height0.394" (10.00mm)
Power Dissipation @ Temperature Rise1.0W @ 40°C
Thermal Resistance @ Forced Air Flow11.70°C/W @ 200 LFM
Thermal Resistance @ Natural40.00°C/W
MaterialAluminum
Material FinishBlack Anodized

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BOYD 散热片 产品 374024B00035G

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