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374424B00035G

¥24.12
散热片
BOYD

HEATSINK BGA W/ADHESIVE TAPE

参数名称参数值
Product StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.063" (27.00mm)
Width1.063" (27.00mm)
Diameter-
Fin Height0.709" (18.00mm)
Power Dissipation @ Temperature Rise4.0W @ 80°C
Thermal Resistance @ Forced Air Flow6.50°C/W @ 200 LFM
Thermal Resistance @ Natural20.30°C/W
MaterialAluminum
Material FinishBlack Anodized

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BOYD 散热片 产品 374424B00035G

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