参数名称 | 参数值 |
---|---|
Product Status | Active |
Type | Top Mount |
Package Cooled | BGA |
Attachment Method | Adhesive |
Shape | Square, Pin Fins |
Length | 0.394" (10.00mm) |
Width | 0.394" (10.00mm) |
Diameter | - |
Fin Height | 0.275" (7.00mm) |
Power Dissipation @ Temperature Rise | 2.0W @ 75°C |
Thermal Resistance @ Forced Air Flow | 16.50°C/W @ 200 LFM |
Thermal Resistance @ Natural | 37.90°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
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CUI Devices 散热片 产品 HSB02-101007
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